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Machine specifications

  • Power Supply: 220VAC +/- 10%, 50/60 Hz
  • Power requirement: 4.5 KVA
  • Compressed Air supply: Filtered Clean Air, 5-7bar
  • Operating Ambient: 18-28 degrees, 40-100% humility, no significant dust
  • Heating Method: Pulse heat
  • Temperature Ramp Profile: 04 stages
  • Start Temperature: 30°C ~ 300°C
  • Ramp Period (1st to 4th Stage): 30°C ~ 450°C
  • Release Temperature: 30°C ~ 450°C
  • Bonding Head Movement: Cylinder


To meet basic requirements for thermo-compression applications for Hot Bar Soldering, ACF Bonding. Pulse Heat Machine TM-100P that is equipped with all required bonding functions provides the ideal solution for precision thermo-compression of FPC to PCB.