+65 67410346

Machine specifications

  • Controller unit: PLC
  • Operation Interface: Color display touch panel
  • Emergency stop switch & grounding connect: Set up on machine unit
  • Cycle time: From 16sec/pcs
  • Heating method: Pulse heat
  • Temperature ramp profile: 04 stages
  • Start temperature: 30°C ~ 300°C
  • Ramp period (1st to 4th stage): 30°C ~ 450°C
  • Release temperature: 30°C ~ 450°C
  • Machine size(L x W x H): 850mm x 920mm x 1664mm
  • Machine Weight: Est.800kg


TM-100PR-SA FOB/FOF Semi-Auto Final Bonding Machine is designed for automatic alignment and final bonding of Flex directly onto PCB/Flex with ACF. PCB/Flex must be laminated with ACF prior to Flex alignment and final bonding process.