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Machine specifications

  • Controller unit: IPC
  • Bonding head: 3
  • Bonding Force: 0.8 kgf ~ 8 kgf
  • Heating Method: Pulse heat
  • Temperature Ramp Profile: 04 stages
  • Start Temperature: 30°C ~ 300°C
  • Ramp Period (1st to 4th Stage): 30°C ~ 450°C
  • Release Temperature: 30°C ~ 450°C
  • Real Time Temperature Profile: Yes
  • Over Temperature Protection: Yes
  • Thermode Size: Max. 25mm x 2mm


TM-807P-3H-A, Auto Final Bond Machine, is designed for automatic final bonding Flex onto Flex/PCB. All FPCs must be pre-tacked onto Flex/PCB with PSA/TSA/ACF adhesive prior to final bonding. Bottom FPCs/PCBs in trays are delivered by external incoming conveyor belt. Finished pre-tacked parts leaves the machine through external conveyor belt in trays.